1.蔡辉，闰逢元，等.环氧树脂研究与应用进展[J].材料导报，2003,17(2):46 2.Shyue,et a l.T hermald egradations tudyo fs iloxane-DGEBA epoxyc opolymers仁J].E urP olym)，1997,(33):3 3.Ananda Kumar S, Sankara T S N. Ther-mal properties of siliconized epoxy interpenetrating coating [J]. Progress InorganicC oating,20 02,(45):323 4.伍越寰.有机结构分析[M].合肥:中国科学技术大学出版社，1993 5.DevroeyD R N ,H ommaM Blendsofs ily-terminatedp olyetherand epoxides as elastic adhesives口〕.Int J Adhesion Adhesives,20 01，(21):275 6.彭荣华，等.有机硅改性环氧结构胶的制备[J].热固性树脂，2002,17(5):17 7.Christine Naito, Michael Todd. The effects of curing parameters on the properties development of an epoxy encapsulantmaterial [J].M icroelectronics Reliability, 2002,(42):119
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